challenger 175

The challenger 175 is a high-precision, customizable sheet-based system for printing, coating, laminating, and drying, ideal for printed electronics and functional device development.

Customizable, High-Precision Sheet-Based Printing and Coating System

With its modular design and multiple inline stations, the challenger 175 ensures precise layer-to-layer registration and supports both rigid and flexible substrates for a wide range of applications.

Applications

Multilayer printing

Research and development in printed electronics

Prototype development

Small batch production

Technical data

Printing/Coating technologies:
Slot Die, Rotary Screen, Flexo, Rotogravure, Gravure Offset, Lamination

Drying methods:
UV, NIR, Photonic Curing, Air Knife, Heated Vacuum Chuck

Substrate pre-treatment:
Corona Pre-treatment

Substrate size:
Up to 300 x 300 mm

Substrate compatibility:
Flexible and rigid substrates up to 3 mm thickness

Process speed:
Up to 60 m/min.

Positioning accuracy:
+/- 10μm

CSV file export/import:
Supported

Automated multiple processes:
Programmable for repeatable coating/printing followed by curing

Dimension (L x W x H):
Configuration dependent (varies by number of modules)

Weight:
Configuration dependent (varies by number of modules)

Technologies & Options

Modular Design

The challenger 175 offers a range of printing, coating, laminating, pre-treatment, and drying technologies, including Slot Die Coating, Rotary Screen, Rotogravure, Flexographic, Gravure Offset, UV, NIR drying, and Corona Pre-treatment. Its modular design ensures seamless integration and adaptability to diverse project needs.

Combo Printing Unit

The unique combo printing unit integrates up to five printing technologies in a single station (Rotogravure, Flexographic, Gravure Offset, Rotary Screen, and Laminating) with quick exchange in less than 15 minutes, enabling seamless transitions between techniques.

Advanced Process Control

Features programmable printing, coating, drying, and laminating processes, CSV file import/export, and real-time monitoring via integrated camera systems for precise alignment.

Substrate Flexibility

Supports both flexible and rigid substrates, up to 3 mm thick, providing versatility for developing printed electronics and functional devices.

Low Ink Consumption & Efficient Printing

The system minimizes ink consumption to less than 1 ml per print, which is advantageous for expensive functional inks, ensuring efficient and cost-effective production.

User-Friendly Operation

The machine features a color touch screen interface and state-of-the-art Beckhoff control technology for intuitive operation and monitoring of the entire process.

Scientific publications

Using Cellulose Nanocrystals (CNCs) and Chitosan to Enhance Barrier Properties of Paper for Sustainable Packaging – University of Maribor’s Work with the challenger 175

Access the full paper here: [Full Publication]

Interested in challenger 175?

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Contact us

Interested in learning more about our machines or finding the right solution for your project? We look forward to hearing from you.